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MNT117 (3 Credits)
Introduction to semiconductor packaging technologies and processes. Covers package types, materials, design considerations, and manufacturing steps from wafer to finished product. Includes electrical, thermal, and mechanical aspects of package design. Examines interconnection technologies, reliability testing, and emerging trends in the semiconductor packaging industry. Emphasizes the role of packaging in electronics systems and its relationship to Moore's Law. Prerequisites: None.
- Term
- Spring 2027
- Weeks
- 8
- Delivery
- Hybrid In-Person
- Designations
- None
- Next Start
- 1/11